Tag Archives: thermal impedance

Journal paper accepted for JJAP

Posted on Friday January 14th, 2022 by ts

The following paper has been accepted for publication in Japanese Journal of Applied Physics (JJAP). This is a joint work with Rohm Co. Ltd. Yohei Nakamura, Naotaka Kuroda, Ken Nakahara, Michihiro Shintani, and Takashi Sato, “Evaluation of thermal couple impedance … Continue reading →

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