ISCAS2021: paper accepted

The following papers have been accepted for presentation in the IEEE International Symposium on Circuits and Systems (ISCAS) 2021. The conference will be held in May 22-28, 2020 in Daegu, Korea.

  • Tatsuki Ono, Song Bian, and Takashi Sato:
    “Automatic Parallelism Tuning for Module Learning with Errors Based Post-Quantum Key Exchanges on GPUs,” in Proc. of IEEE International Symposium on Circuits and Systems (ISCAS) (Daegu, Korea), May 2021 (to appear).
  • Takashi Sato, Yuki Tanaka, and Song Bian:
    “Clonable PUF: On the Design of PUFs That Share Equivalent Responses,” in Proc. of IEEE International Symposium on Circuits and Systems (ISCAS) (Daegu, Korea), May 2021 (to appear).
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Oshima received the IEEE CEDA All Japan Joint Chapter Academic Research Award

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Paper accepted for publication in Japanese Journal of Applied Physics

We are pleased to announce that the following two papers have been accepted for publication in Japanese Journal of Applied Physics (JJAP).
Oshima’s paper is a joint work with AIST.

  • Kyohei Shimozato, Yohei Nakamura, Song Bian, and Takashi Sato, “An electrothermal compact model of SiC MOSFETs for analyzing avalanche failure mechanism,” Japanese Journal of Applied Physics (JJAP), (to appear) doi: 10.35848/1347-4065/abdc5c .
  • Kunihiro Oshima, Song Bian, Kazunori Kuribara, and Takashi Sato, “Separation of bias stress degradation factors in organic thin-film transistors,” Japanese Journal of Applied Physics (JJAP), (to appear) doi: 10.35848/1347-4065/abdcb2 .
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Paper accepted for publication in Japanese Journal of Applied Physics

The following paper has been accepted for publication in Japanese Journal of Applied Physics (JJAP).
This work has been done in collaboration with AIST.

  • Zhaoxing Qin, Song Bian, Kazunori Kuribara and Takashi Sato:
    “Stable organic SRAM cell with p-type access transistors,” Japanese Journal of Applied Physics, (to appear) doi: 10.35848/1347-4065/abd534.
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IEEE Kansai Chapter MFSK Award

Oshima (M2) received the IEEE Kansai Chapter MFSK Award at the 20th IEEE Kansai Colloquium on Electronic Devices held online on November 27. The awarded presentation is as follows.

  • Experimental study of bias stress degradation of organic thin filmtransistors [SSDM],
    K. Oshima, M. Saito, M. Shintani, K. Kuribara, Y. Ogasahara, and T. Sato.
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SSDM2020

Shimosato (M1), Qin (D1), and Oshima (M2) presented their papers at SSDM2020 (International Conference on Solid State Devices and Materials 2020) held on September 27-30, 2020 (Qin on 29th, Oshima on 29th, Shimosato on 30th).

Shimosato’s presentation was about the simulation of SiC MOSFET operation in UIS (Unclamped inductive switching) test. UIS test is to investigate the switching tolerance in circuits with inductive loads. When the inductive electromotive force generated during the switch-off period exceeds the breakdown voltage of the MOSFET, an avalanche current flows even though the MOSFET is in the off state. This phenomenon continues until all the energy stored in the inductor is consumed. If the energy exceeds a certain value, the MOSFET will break down in the process. In this study, the behavior of the parasitic bipolar transistor and the intrinsic operation of SiC due to high temperature were incorporated to the simulation model, and thermoelectric simulation was performed. In the simulation, the intrinsic behavior of SiC was modeled as a resistance whose value rapidly decreases under high temperature conditions. The simulation results were confirmed to match well with the actual measurement results. The simulation results indicated that the failure in the UIS test was mainly due to the intrinsic behavior of the SiC.

Qin’s presentation is on the design of SRAM cells based on organic thin film transistors (OTFTs). OTFTs are promising devices for developing new circuits due to their low cost of fabrication on flexible materials such as films. Organic SRAM is used for data storage in flexible organic systems. However, due to the large difference in drivability between n-type and p-type devices, the SRAM circuit design currently used in silicon cannot be applied to OTFTs. In this study, we use p-type OTFTs as access transistors to improve area efficiency and robustness. The stability of the proposed SRAM has been optimized by SPICE simulation. The actual measurements on a test chip have confirmed that the proposed SRAM cell can operate correctly and stably.

Oshima’s presentation is about the quantitative analysis of threshold voltage fluctuation of organic thin-film transistors (OTFTs) under applied voltage. OTFTs are attracting attention for applications such as wearable sensors because of their ability to fabricate circuits on flexible substrates. However, OTFTs are known to degrade rapidly due to stress voltages applied during circuit operation. Thus, suppression of degradation is a challenge for practical use of OTFT circuits. In order to improve the lifetime of OTFTs, we focused on the carrier trapping in the insulating film and that in the semiconductor layer as the cause of bias-stress degradation, and proposed a method to identify which one has a larger impact on the threshold voltage fluctuation. By applying the proposed method to the measured threshold voltage changes, it was found that the carrier capture in the semiconductor layer was dominant in the p-type device, while both the carrier capture in the semiconductor layer and the insulator were equally influential in the n-type device, indicating that the physical mechanism of degradation was different between the p-type and n-type devices.

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WiPDA2020

Shimosato, M1, presented his research in The IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA-Asia) held as an online conference on September 23-25, 2020 (Presentation date: September 24).

SiC MOSFETs are expected to be the next generation devices for power converters in electric vehicles and trains because of their excellent properties. SiC MOSFETs are used as switches in circuits. During switching, they pass through an operating point with high voltage and high power, causing self-heating, which can lead to characteristic degradation or breakdown. Normally, we design the circuits so that such problems will not occur, but depending on the circuit and operating conditions, they sometimes happen.

In this study, we proposed a simulation model that can be used over a wide range of temperatures, which is necessary for simulating circuits under such severe conditions. The two physical phenomena that are responsible for the temperature dependence are separated and formulated as simple equations. In addition, the current characteristic measurements, which have been limited to about 200°C in existing studies, were carried out up to temperatures above 300°C. It was shown that the proposed model fits well with the measurement results. We confirmed the effectiveness of the proposed model by demonstrating that the errors are smaller than those of the existing models in all measured temperature ranges.

  • Kohei Shimozato and Takashi Sato, “A Compact device model for SiC MOSFETs valid for wide-temperature range,” in Proc. IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA-Asia), pp.56-60, September 2020.
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USENIX2021: paper accepted

The following paper has been accepted for the USENIX Security Symposium 2021, to be held on August 11-13, 2021.

  • Kotaro Matsuoka, Ryotaro Banno, Naoki Matsumoto, Takashi Sato, and Song Bian:
    “Virtual Secure Platform: A Five-Stage Pipeline Processor over TFHE,”
    USENIX Security Symposium (Vancouver, Canada), Aug. 2021 (to appear).
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NeurIPS2020: paper accepted

The following paper has been accepted for presentation in the Conference on Neural Information Processing Systems (NeurIPS) 2020 (Acceptance rate 20.1%=1900/9454).
This work was in collaboration with Prof. Lei Jiang at Indiana University Bloomington.

  • Qian Lou, Song Bian, and Lei Jiang:
    “Autoprivacy: Automated Layer-Wise Parameter Selection for Secure Neural Network Inference,” Conference on Neural Information Processing (NeurIPS) (Vancouver, Canada), Dec. 2020 (to appear).
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DA symposium

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