The following paper has been accepted for publication in Japanese Journal of Applied Physics (JJAP). This is a joint work with Rohm Co. Ltd.
- Yohei Nakamura, Naotaka Kuroda, Ken Nakahara, Michihiro Shintani, and Takashi Sato, “Evaluation of thermal couple impedance model of power modules for accurate die temperature estimation up to 200℃,” Japanese Journal of Applied Physics (JJAP), Vol.61, January 2022. doi:10.35848/1347-4065/ac4b0c