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Daily Archives: Wednesday June 23rd, 2021
Paper accepted for presentation in SISPAD 2021
The following two papers have been accepted for presentation at the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 2021. Kyohei Shimozato, Yohei Nakamura, and Takashi Sato, “Analysis of thermal concentration failure in unclamped inductive switching based on … Continue reading
Posted in Conference/Workshop
Tagged device model, electro-thermal simulation, power device, reliability, statistical simulation
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