Awards received at the 31st circuit and system symposium

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The 32nd circuits and systems workshop @ TDU

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Paper accepted, Integration, the VLSI Journal

Our joint research with Prof. Sheldon Tan of University of California, Riverside, who visited us as a JSPS Postdoctoral Fellow, has been accepted for publication in Integration, the VLSI Journal.

  • Chase Cook, Hengyang Zhao, Takashi Sato, Masayuki Hiromoto, and Sheldon Tan, “GPU-based Ising computing for solving max-cut combinatorial optimization problems,” Integration, the VLSI Journal, (accepted for publication).
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FLEPS2019

Qin, M2, presented his research in IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) 2019 held in Glasgow, UK on July 7-9, 2019 (Presentation date: 9th).

Qin’s presentation is on the design of organic transistor-based PUF circuits, which exploit the variability in device manufacturing to achieve authentication. The goal is to create a hard-to-replicate tag that can authenticate various products by leveraging the advantages of organic transistors that can be fabricated on flexible substrates at low cost. In this presentation, we proposed a current mirror array PUF circuit that can compensate for the degradation of organic devices. The circuit can self-compensate for transistor degradation over time by sharing the gate voltage of the current mirror. Through measurements of the proposed circuit over a period of one month, we evaluated randomness, diffusivity, and reproducibility, which are key metrics for evaluating PUFs, and confirmed that the proposed circuit is highly tolerant of response changes due to device degradation.

  • Zhaoxing Qin, Michihiro Shintani, Kazunori Kuribara, Yasuhiro Ogasahara, and Takashi Sato, “OCM-PUF: Organic current mirror PUF with enhanced resilience to device degradation,” in Proc. IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), P-47 , July 2019.
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A paper accepted for ICSCRM2019 in Kyoto

The following paper has been accepted as an oral presentation in International Conference on Silicon Carbide and Related Materials (ICSCRM) 2019.

  • Michihiro Shintani, Kazuki Oishi, and Takashi Sato, “A three-level active gate drive circuit for power MOSFETs utilizing a generic gate driver IC,” in Proc. International Conference on Silicon Carbide and Related Materials (ICSCRM), (to appear)
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SSDM 2019: paper accepted

The following paper has been accepted as an oral presentation in International Conference on Solid State Devices and Materials (SSDM) 2019.

  • Kunihiro Oshima, Michiaki Saito, Michihiro Shintani, Kazunori Kuribara, Yasuhiro Ogasahara, and Takashi Sato, “Experimental study of bias stress degradation of organic thin film transistors,” in Proc. International Conference on Solid State Devices and Materials (SSDM), (Nagoya, Japan) Sep. 2019. (to appear)
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EE baseball cup tournament 2019

The first round of the EE (Electrical and Electronic engineering) baseball cup tournament was held in June 10th at Kyoto imperial palace sports ground. We played hard against the joint team of Ishii / Matsuda labs, but unfortunately eliminated with a score of 4-8.

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(日本語) 短期交流学生

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DAC2019

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(日本語) Chip Hong Chang先生講演会

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