The following two papers have been accepted for presentation at the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 2021.
- Kyohei Shimozato, Yohei Nakamura, and Takashi Sato, “Analysis of thermal concentration failure in unclamped inductive switching based on three-dimensional electro-thermal simulation with on-chip variation,” in Proc. International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), (to appear)
- Hiroki Tsukamoto, Song Bian, and Takashi Sato, “Statistical device modeling with arbitrary model-parameter distribution via Markov Chain Monte Carlo,” in Proc. International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), (to appear)