A paper accepted for poster presentation in FLEPS2019, Grasgow

Posted on Tuesday May 14th, 2019 by ts

A paper entitled “OCM-PUF: an organic current mirror PUF with enhanced resilience to device degradation”, has been accepted for poster presentation at the 2019 IEEE International Conference on Flexible & Printable Sensors & Systems, to be held in Glasgow, Scotland from July 7-10, 2019.

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